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Articles tagged with "EUV, lithography, semiconductor"

Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips — 20% gain in photoresist improvement from increased oxygen concentration

Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips — 20% gain in photoresist improvement from increased oxygen concentration

Imec has developed a new method that enhances the photo-speed of metal-oxide resist (MOR) by increasing oxygen concentration during the EUV post-exposure bake (PEB) step, leading to a 15%-20% improvement in photo-speed. This advancement allows the resist to reach target dimensions at a lower EUV dose, boosting EUV scanner throughput and reducing exposure costs. Metal-oxide resists are becoming crucial for advanced chip production using EUV lithography due to their high resolution and favorable characteristics. Imec's findings suggest that optimizing environmental conditions during the PEB step can further enhance MOR performance, potentially impacting semiconductor manufacturing processes.

Tom's Hardware•
ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030 — new 1,000-watt light source fires three lasers at 100,000 tin droplets every second

ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030 — new 1,000-watt light source fires three lasers at 100,000 tin droplets every second

ASML has made a significant breakthrough in EUV chipmaking technology, aiming to boost processing speed by 50% by 2030 with a new 1,000-watt light source that fires three lasers at 100,000 tin droplets per second. This advancement is expected to enhance productivity and reduce costs for chip manufacturers. Achieving a 1,000W EUV light source required doubling the number of tin droplets and utilizing two laser pulse sequences. ASML's roadmap includes integrating the 1,000W light source into its future EUV lithography systems to increase productivity to 330 wafers per hour by 2030.

Tom's Hardware•
China's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip — sanctions-busting experiment is still years away from becoming operational

China's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip — sanctions-busting experiment is still years away from becoming operational

A covert laboratory in China reportedly reverse-engineered an extreme ultraviolet (EUV) lithography scanner, but the cobbled-together machine has not produced any chips and is years away from being operational. While there are rumors of stolen parts and components, replicating an entire EUV lithography tool is challenging due to the complex global supply chain and proprietary technology involved. Chinese chipmakers have attempted to upgrade existing tools with third-party components but may not meet the quality standards of the original manufacturer, ASML. Despite efforts to DIY advanced lithography tools, lacking access to proprietary software and firmware hinders full replication of ASML's technology.

Tom's Hardware•

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