ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030 — new 1,000-watt light source fires three lasers at 100,000 tin droplets every second

ASML has made a significant breakthrough in EUV chipmaking technology, aiming to boost processing speed by 50% by 2030 with a new 1,000-watt light source that fires three lasers at 100,000 tin droplets per second. This advancement is expected to enhance productivity and reduce costs for chip manufacturers. Achieving a 1,000W EUV light source required doubling the number of tin droplets and utilizing two laser pulse sequences. ASML's roadmap includes integrating the 1,000W light source into its future EUV lithography systems to increase productivity to 330 wafers per hour by 2030.