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Low Temperature Cu-Cu Bonding for Advanced Packaging (NYCU)

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SemiEngineering

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Researchers at National Yang Ming Chiao Tung University published a technical paper on enhancing the thermal stability of low-temperature Cu-Cu bonding for advanced electronic packaging. They introduced a thin Ag passivation layer to enable reliable bonding at lower temperatures, improving durability against high-humidity and high-temperature environments. The passivation layer demonstrated enhanced thermal stability, as confirmed by stress tests and burn-in measurements. The study emphasizes the importance of metal passivation in enabling low-temperature Cu-Cu bonding technologies for next-generation advanced packaging platforms.

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