Intel's EMIB-T packaging technology set for fab rollout this year — as TSMC CoWoS capacity remains limited,EMIB-T is preparing for advanced AI accelerator designs

Intel's EMIB-T packaging technology, an advanced variant of Intel's embedded bridge technology, is set to enter production fab rollout this year. This technology, which incorporates through silicon vias (TSVs), is designed to address limitations in high-power AI accelerator designs, offering improved power delivery and package scaling. Intel Foundry is close to securing significant deals in revenue through advanced packaging, with EMIB-T driving customer interest. The technology aims to convert Intel's packaging capabilities into revenue from AI accelerators, positioning it as a key player in the tech industry. Despite TSMC's limited CoWoS capacity, Intel's EMIB-T is poised to make a significant impact in the market, offering cost-effective and efficient packaging solutions for advanced semiconductor designs.