YMTC's third Wuhan fab clears Beijing's 50% local tooling threshold as two more are planned — move positions company toward 3D NAND production to capitalize on wafer bonding strengths

YMTC's Phase 3 Wuhan fab is set to open later this year, meeting Beijing's requirement for new Chinese fabs to source at least 50% of their equipment domestically. The company plans to add two more fabs of similar scale in the future. The move towards 3D NAND production leverages China's strengths in wafer bonding technologies. Despite reliance on imported lithography tools, YMTC aims to achieve 50% domestic tooling by substituting in other areas like etch, deposition, and cleaning. Additionally, part of the new fabs' capacity will be allocated to DRAM production, with YMTC making strides in developing its own DRAM technology.