'Beyond EUV' chipmaking tech pushes Soft X-Ray lithography closer to challenging Hyper-NA EUV — 'B-EUV' uses new resist chemistry to make smaller chips

Researchers at Johns Hopkins University have introduced a new chipmaking method using Soft X-rays with a wavelength of 6.5nm to 6.7nm, aiming to achieve resolutions of 5nm and below. This 'beyond-EUV' technology could potentially challenge the current industry-standard EUV lithography. By utilizing metals like zinc, the team found that B-EUV light can trigger chemical reactions in organic compounds, enabling the creation of fine patterns on semiconductor wafers. While challenges remain, this innovative approach offers a promising step towards developing smaller and more advanced chips.