AI chip design is pushing advanced chip packaging to its limits – workarounds exist for limits of 2.5D packaging, but are years away from viability

Advanced chip design is increasingly relying on 2.5D packaging for power delivery and signal integrity, especially as AI accelerators and HPC devices grow more complex. Engineers are thickening silicon interposers to support higher memory interfaces and chiplet counts, but face challenges with warpage and mechanical stability. The concept of active interposers, integrating logic into power platforms, is still rare due to yield concerns. Silicon bridges offer cost savings over interposers, but misalignment issues during assembly can impact overall yields. Organic and glass alternatives are being explored for future packaging solutions, but density and cost challenges remain.