Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year

Intel is reportedly in discussions with Google and Amazon to provide advanced chip packaging services for their custom AI processors. These talks could lead to significant revenue for Intel Foundry, with potential deals worth billions of dollars per year. The focus is on Intel's advanced packaging technologies like EMIB and Foveros, with the upcoming EMIB-T expected to enhance power delivery and signal integrity. Intel is expanding its packaging capacity across multiple countries, including new facilities in New Mexico, Malaysia, and plans for additional sites in South Korea, Portugal, and Arizona. The importance of chip packaging for AI computing is emphasized by Intel executives, with packaging revenue projections exceeding $1 billion and aiming for 40% gross margins.