Reducing Risk Early: Multi-Die Design Feasibility Exploration
The semiconductor industry is shifting towards multi-die architectures for improved performance and efficiency. However, this approach introduces complexity in design decisions. Feasibility exploration is crucial in evaluating multi-die design architectures early on to prevent issues in manufacturability and reliability. Modeling techniques like pixel-based power delivery network modeling and simplified bump and TSV models aid in rapid exploration. The Synopsys 3DIC Compiler platform streamlines feasibility exploration by integrating modeling, analysis, and visualization capabilities. Feasibility exploration sets the stage for detailed interconnect planning in multi-die implementations.
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