Thermal pads with in-built vapor-chambers claim 50 to 80 times better thermal conductivity than normal thermal pads — 1,200 W/m-K "Vapor-Pad" from Xerendipity designed to replace traditional TIM in a CPU

Xerendipity introduces the "Vapor-Pad," a thermal pad with an in-built vapor chamber claiming 50 to 80 times better thermal conductivity than traditional thermal pads, designed to replace thermal interface material (TIM) in CPUs. The Vapor-Pad combines the cost-effectiveness of thermal pads with the efficiency of vapor chambers, offering improved heat dissipation capabilities. Additionally, Xerendipity's Non-Metal Vapor Chamber (NVMC) aims to cool devices without disrupting signals, providing effective thermal management while maintaining signal pass-through. Despite being a newcomer in the market, Xerendipity's innovative products show promise for enhancing thermal performance in various devices.