Technology

Research Bits: August 26

Source

SemiEngineering

Published

Aug 26, 2025

TL;DR

AI Generated

Researchers from EPFL and Harvard University have developed a chip that can convert electromagnetic pulses in the terahertz and optical ranges on the same device, enabling applications in communication, sensing, and computing. Another team from various universities created tunable capacitors made of graphene to modulate terahertz signals, achieving high modulation depth. Additionally, a group from MIT, Gwangju Institute of Science and Technology, and University of Michigan designed a reconfigurable antenna that adjusts its frequency range by changing its physical shape, offering versatility for various applications like energy transfer and wireless communication. These innovations showcase advancements in terahertz technology and metamaterial applications.

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3D Printing To Create Spatially Freeform, Nanomaterial-based Electronics (Rice, U. of Utah, NUS)

Researchers from Rice University, University of Utah, and National University of Singapore have published a paper on using 3D printing to create nanomaterial-based electronics with a metamaterial-inspired near-field electromagnetic structure. The research focuses on achieving selective and rapid heating of 3D-printed nanomaterials and polymers using microwaves, enabling the creation of freeform microstructures with locally programmable electronic and mechanical properties. This approach broadens the range of materials compatible with 3D printing and opens up new possibilities for creating challenging classes of electronics.

SemiEngineering•

3 months ago

Wonky Graphene Could Sharpen Proton Therapy

IEEE Spectrum•

9 months ago

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.

SemiWiki•

8 hours ago

MindsEye's sabotage mission is being slammed as dull and pointless

Build A Rocket Boy accuses individuals of sabotaging MindsEye's launch, spending over €1 million on damaging efforts. The studio integrates the controversy into a new in-game mission, Blacklist, to showcase evidence of sabotage to players. However, reports describe the mission as lackluster and failing to deliver a compelling narrative. Critics attribute the launch issues to internal problems, such as management and design decisions, casting doubt on the sabotage claims. The saga continues as MindsEye's post-launch turmoil unfolds.

TweakTown•