Rare wooden-cased Apple-1 computer blasts past auctioneer estimate — sells for almost half a million dollars

‘Proper next-gen Amiga’ launched by Apollo Computing — promises full FPGA-powered backwards compatibility with its new 68080 chip

Apollo Computing has launched the Apollo A6000, a modern Amiga system featuring the advanced V4 AC68080 FPGA chip, promising full backwards compatibility with Amiga 68k software. The system boasts a retro design reminiscent of the Amiga A600, along with impressive tech specs and a built-in mechanical keyboard. The AC68080 FPGA, developed over 10 years, offers significant processing power and compatibility with a wide range of legacy software. Priced at over $1,000, the A6000 has already sold out its initial run in Germany, with more units expected in the future. Other companies are also working on new Amiga-like machines, catering to fans of retro computing.

Rare Apple-1 with storied ownership could fetch over $300,000 at auction — unit housed in original wood case thought to be one of just nine surviving examples

A rare fully functional Apple-1 computer in its original wooden case, thought to be one of only nine surviving examples, is up for auction and expected to fetch over $300,000. The auction includes all components and accessories needed for operation, such as a cassette interface, keyboard, monitor, and software. The computer, owned by the first female Stanford Law School graduate, June Blodgett Moore, is graded at 8.0/10 despite some minor issues due to its age. Additionally, an auction for a 'Steven Jobs' signed Apple Computer Company check is also taking place, with bidding already surpassing the expected price of $25,000.

Commodore raked in over $2 million during the new C64 Ultimate's debut week — roadmap will include three major releases a year

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.