Quantifying The Impact Of Gravity On Strip Warpage Across Assembly Stages

The article discusses the importance of accurately simulating strip warpage in electronic packages during the assembly process. Simulations often neglect the impact of gravity on strip warpage, leading to unrealistic results compared to actual measurements. By including gravity in simulations, more accurate predictions can be made. The study explores how various parameters, such as strip geometry and substrate stiffness, influence the effect of gravity on warpage. Validation results show that including gravity in simulations significantly reduces warpage after certain assembly stages, particularly when epoxy molding compound (EMC) is included in the strip. The study also examines the impact of strip size, number of blocks, cored vs. coreless substrates, and the presence of slots on strip warpage.