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Opening The Door To STCO: Hierarchical Device Planning

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SemiEngineering

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AI Generated

The article discusses the importance of Hierarchical Device Planning (HDP) in managing the complexity of integrating multiple chiplets in a single packaging platform for high-performance applications like AI and autonomous vehicles. HDP enables a more robust System Technology Co-Optimization (STCO) by breaking down design challenges into manageable segments and facilitating early analysis of physical effects during package prototyping. By integrating established hierarchical design methodology techniques, HDP allows for more informed decisions and iterative design changes, reducing costs and enhancing efficiency. The article emphasizes the significance of conducting multi-domain analyses early in the design cycle and highlights the benefits of using HDP to optimize package layouts and manage interface connectivity effectively.

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