New Challenges In Signoff

The article discusses the increasing challenges in signoff processes due to multi-die assemblies and advanced process nodes. With more corner cases and data to consider, there is no room for delays in delivery schedules. Marc Heyberger from Cadence Design Systems talks about full-chip timing, flat versus hierarchical timing analysis, the development of full 3D-ICs, and the role of AI in addressing these challenges. Key topics include Cadence ECOs, signoff, timing analysis, and verification.