Reliability And Traceability In Advanced Packages

The article discusses the challenges of ensuring reliability and traceability in advanced packages, especially in multi-die assemblies. Moving from planar SoCs to advanced packages can enhance performance and flexibility in large designs that don't fit on a single die. Various packaging options like 2.5D, fan-out wafer-level packaging, and 3D-ICs introduce complexities in data collection and analysis. Afkhar Aslam, CEO of yieldWerx, explains how to identify the root cause of failures, the impact of different materials and bonding methods, and potential issues that can arise in the process.