Technology

Reliability And Traceability In Advanced Packages

Source

SemiEngineering

Published

Dec 24, 2025

TL;DR

AI Generated

The article discusses the challenges of ensuring reliability and traceability in advanced packages, especially in multi-die assemblies. Moving from planar SoCs to advanced packages can enhance performance and flexibility in large designs that don't fit on a single die. Various packaging options like 2.5D, fan-out wafer-level packaging, and 3D-ICs introduce complexities in data collection and analysis. Afkhar Aslam, CEO of yieldWerx, explains how to identify the root cause of failures, the impact of different materials and bonding methods, and potential issues that can arise in the process.

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Read-Centric DTCO for IGZO FeFETs 3D Heterogeneous AI memories (imec, KU Leuven)

Researchers from imec and KU Leuven have published a technical paper titled "DTCO of NOR-Type IGZO FeFETs for 3D Heterogeneous AI Memories: A Read-Centric Perspective." The paper evaluates the feasibility of using NOR-type IGZO FeFETs for 3D heterogeneous AI memories from a read-centric design-technology co-optimization (DTCO) standpoint. The study covers various memory architectures, including on-chip back-end-of-line (BEOL) RAMs, hybrid-bonded memory chiplets, and off-chip monolithically integrated 3D FeNOR storage-class memories (SCMs). The research aims to advance the development of efficient and effective memory designs for AI applications.

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Read-Centric DTCO for IGZO FeFETs 3D Heterogeneous AI memories (imec, KU Leuven)

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Reliability And Traceability In Advanced Packages

TL;DR

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Reliability And Traceability In Advanced Packages

TL;DR

Similar Articles

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Reduce Memory Redesigns With Shift-Left

Orbital Data Centers Are Souped-Up Satellites – For Now

Scaling Nanoribbon Transistors with Monolayer TMDs (Stanford, Chalmers, Horiba, SLAC)