Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

Share prices of Intel and SK hynix have surged after reports of their collaboration on 2.5D chip packaging using Intel's EMIB technology for integrating HBM and logic semiconductors. SK hynix's shares hit an all-time high, climbing 14.5%, while Intel's share price rose nearly 14%. Intel's EMIB and EMIB-T technologies are gaining traction, with potential deals worth billions in revenue. SK hynix is independently developing 2.5D packaging facilities and, if the partnership with Intel materializes, it would provide an additional packaging pathway for SK hynix alongside its existing facilities and TSMC's CoWoS technology.