Huawei reveals long-range Ascend chip roadmap — three-year plan includes ambitious provision for in-house HBM with up to 1.6 TB/s bandwidth

Huawei has unveiled its long-term Ascend chip strategy, with plans for four new chips over the next three years, including the Ascend 950PR and 950DT in early 2026. The company aims to incorporate in-house HBM technology with up to 1.6 TB/s bandwidth in its upcoming chips, challenging competitors like SK hynix and Samsung. Despite facing constraints due to U.S. sanctions limiting access to advanced nodes and packaging lines, Huawei is pushing forward with ambitious plans for AI compute clusters like the Atlas 950 and 960 systems. To compete with Nvidia, Huawei will need a comprehensive platform that matches in training, efficiency, and model throughput.