Micron teams up with TSMC to deliver HBM4E, targeted for 2027 — collaboration could enable further customization

Micron has announced a collaboration with TSMC to produce the base logic die for its upcoming HBM4E memory, set for production in 2027. This partnership will allow for customization of memory solutions for AI workloads, positioning Micron at the forefront of AI system design. HBM4E will offer higher data rates and customized options, with Micron focusing on efficiency and flexibility in its design approach. The move aligns with the industry trend towards customizable memory solutions, particularly crucial for next-generation data center GPUs from Nvidia and AMD. Micron's partnership with TSMC aims to make HBM4E a standard memory tier for AI infrastructure in the coming years.