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DSA Method Of 3D Interconnected Structures In Thin Films (MIT)

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SemiEngineering

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Researchers at MIT have published a technical paper on a new method called "Directed self-assembly of 3D interconnected networks" using block copolymers. This method aims to extend pattern generation into 3D structures, enhancing nanoscale manufacturing capabilities. By combining surface modification, BCP periodicity, and topographic templates, the method can create various highly ordered 3D interconnected networks like ladder and cross-point structures. The paper demonstrates a hierarchical DSA approach to generate cross-point structures with connected in-plane and out-of-plane segments, expanding the utility of BCPs in nanofabrication.

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