Beating The Heat In 3D Packages

Thermal management is crucial in multi-die assemblies, with AI accelerators and HPC pushing power densities to 1kW and beyond. Engineers are using finite element modeling with adaptive meshing to accurately simulate thermal conduction profiles. Organizations like AMD, Fraunhofer IIS/EAS, Amkor, and Imec are developing innovative strategies to validate simulation results with real-world experimental data. With the shift to multi-die packaging, thermal management approaches have evolved, emphasizing system-level technology co-optimization (STCO) methods early in the design process. AI plays a key role in identifying hot spots and optimizing meshing for accurate thermal simulations.