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ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond

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Tom's Hardware

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ASML's roadmap for chipmaking lithography tools covers four generations of technology: DUV immersion, low-NA EUV, High-NA EUV, and a Hyper-NA concept for the 2030s. Each generation offers finer resolution at higher costs and complexity, impacting the pace of transistor scaling. TSMC opts for low-NA EUV for its upcoming nodes, while ASML's High-NA tools are being adopted by Intel, Samsung, and SK hynix. The company's roadmap includes advancements in resolution and throughput, with a focus on High-NA and future Hyper-NA systems. Challenges like pellicle development and export controls shape the landscape of lithography technology adoption.

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