Applied Materials preps for 'Angstrom Era' in chipmaking — spearheaded by its new Kinex, Xtera, and PROVision 10 systems

Applied Materials has introduced three new chipmaking tools - Kinex, Xtera, and PROVision 10 - to usher in the 'angstrom era' of chipmaking, focusing on next-generation process technologies controlled at the atomic level. Kinex is a die-to-wafer hybrid bonding tool for direct copper-to-copper interconnects, Centura Xtera is an epitaxial deposition platform for void-free GAA transistor structures, and PROVision 10 is an eBeam metrology system for precise imaging in 3D logic and memory manufacturing. These tools aim to improve performance efficiency and yields in semiconductor production. However, due to U.S. restrictions, these products will not be available to Chinese chipmakers, impacting Applied Materials' revenue projections for 2026.