Microsoft-backed start-up raises $40 million for helium atom beam lithography that could print chips at atomic resolution — 0.1nm beam is 135 times narrower than ASML's EUV light
Norwegian start-up Lace Lithography, backed by Microsoft, secured $40 million in funding to develop a chipmaking tool using a helium atom beam for atomic resolution printing on silicon wafers. The technology boasts a beam width of 0.1 nanometers, significantly narrower than ASML's EUV scanners. Lace's system, named "BEUV," surpasses traditional lithography by utilizing neutral helium atoms instead of photons, potentially enabling chip manufacturers to achieve "ultimately atomic resolution." While Lace's innovative approach differs from other lithography alternatives, transitioning from prototype to production remains a significant challenge, with a target for a pilot fab test tool by 2029.
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