SemiEngineering
Chip Industry Technical Paper Roundup: Oct. 28
The article discusses various technical papers in the chip industry, including topics like vertically integrated hybrid large area electronics, 3D-IC thermal simulation, photonics for sustainable AI, AI efficiency in data centers, and microarchitectural defense against electromagnetic side-channel attacks. The papers come from institutions like KAUST, Imperial College London, Intel Corporation, University of California Santa Barbara, and more. These papers cover cutting-edge research and advancements in semiconductor technology.
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