Analysis of Thermal and Mechanical Behavior for Advanced Packaging (Sungkyunkwan Univ. et al)
Researchers from Sungkyunkwan University, Korea Institute of Industrial Technology, Korea University, Seoul National University, and Pukyong National University have published a technical paper titled "A review of the thermo-mechanical analysis framework for microelectronics packaging." The paper emphasizes the importance of integrating mechanics, material property determination, and structural considerations to understand and optimize microelectronics packaging as its behavior becomes more complex. The study delves into the mechanics, material properties, and structural aspects crucial for advanced packaging in microelectronics.
SemiEngineering•