The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS, Co-Packaged Optics, And More
The article discusses the challenges faced by manufacturers in producing specialty devices like MEMS, co-packaged optics, SiC, GaN power devices, and more as they scale up and diversify. These devices require unique materials, architectures, and process steps, leading to complex manufacturing and process control challenges. For example, MEMS devices rely on specific materials and processes for functionality, while power devices like SiC and GaN face hurdles like crystalline defects and thickness uniformity. Photonics and co-packaged optics introduce further complexity, requiring precision in waveguides, microlenses, and assembly processes. Advanced metrology and inspection solutions are crucial for achieving high-volume production of these specialty devices.