ASML launches revolutionary lithography scanner for advanced 3D chip packaging — Twinscan XT:260 machine quadruples throughput
ASML has unveiled the Twinscan XT:260 lithography scanner, designed specifically for advanced 3D chip packaging, offering quadruple the throughput of existing solutions. The scanner supports high-dose exposures and a large image field, enabling efficient processing of interposers without stitching. With a resolution of 400 nm, 35 nm overlay, and capabilities for through-silicon alignment, the XT:260 is optimized for technologies like Intel's Foveros and TSMC's CoWoS. This tool represents a significant leap in productivity and precision compared to existing options, setting the stage for broader adoption of advanced packaging technologies in the future.
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