Empower Unveils High-Density Silicon Capacitors for Co-Packaging with AI Chips
Empower Semiconductor has introduced a new lineup of embedded silicon capacitors (ECAPs) designed to address power-integrity demands of AI and high-performance computing chips by being co-packaged with them. The ECAPs offer higher capacitance density in compact packages suitable for integration at the processor level, enhancing power integrity. Empower is also introducing integrated voltage regulators (IVRs) to improve power efficiency for AI chips. These IVRs, based on CMOS technology, support faster transient responses and more granular power control, aiding in power delivery efficiency.
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