SemiEngineering
AI-Driven Collaboration In Chip Manufacturing
AI-driven collaboration in chip manufacturing is discussed in this article, focusing on how AI agents can streamline the process and improve data security. The use of 3D chips and multi-die assemblies can enhance performance and power but also increase the complexity of generating working silicon. John Kibarian, CEO of PDF Solutions, explains how agentic AI can reduce time to market by automating interactions and enhancing data security in a multi-vendor environment. Key topics covered include IP security, agentic AI, 3D chips, and multi-die assemblies.
SemiEngineering•