The Ultimate 3D Integration Would Cook Future GPUs
Imec has developed a plan for advanced 3D integration to enhance future GPUs, focusing on keeping them cool. The plan involves high-bandwidth memory connected to the AMD Instinct MI300X GPU's logic die. This approach aims to optimize system technology by utilizing 3D stacking and advanced packaging techniques. The strategy is set to revolutionize semiconductor design and improve performance in the realm of GPU technology.
IEEE Spectrum•