Articles tagged with "2D materials, AI diagnostics, photonic packaging"

Research Bits: Mar. 31

Researchers have made advancements in three key areas of technology: 2D hard mask material, defect identification, and extreme photonic packaging. The use of chromium oxychloride as a hard mask material has shown promise due to its resistance to plasma etching and ability to create sharp, vertical structures. An AI model developed by MIT and Oak Ridge National Laboratory can classify and quantify defects in semiconductor materials using neutron-scattering data. Additionally, researchers at the National Institute of Standards and Technology have developed a photonic chip packaging process that can withstand extreme environments, such as deep space and nuclear reactors.