Back to home
Technology

World's first laser communication link between a plane and satellite ran at 1 Gbps — 10-watt laser which has a 3,417 mile range and 2.5 Gbps max data rate

Source

Tom's Hardware

Published

TL;DR

AI Generated

General Atomics and Kepler Communications have achieved a milestone by successfully testing a laser communication link between an aircraft and a satellite, reaching data speeds of up to 1 Gbps. The Optical Communication Terminal (OCT) used in the test is equipped with a 10-watt laser capable of a 3,417-mile range and a maximum data rate of 2.5 Gbps. This technology has the potential to revolutionize high-speed communication where traditional radio-based methods fall short. The success of this test demonstrates the feasibility of using laser communication for secure and robust data transfers in tactical and operational missions. Future plans include showcasing laser communications with the U.S. Space Development Agency's Tranche-1 compatible satellites in 2026.

Read Full Article

Similar Articles

3DPrint.com

Phase3D Brings Its Fringe Inspection Hardware to Colibrium M2 Series 5 3D Printers

Phase3D has introduced its Fringe Inspection M2 Series 5 Kit for Colibrium Additive’s M2 Series 5 metal printer, catering to the aerospace and defense sectors. The hardware solution aims to reduce the cost of qualifying materials in metal additive manufacturing through real-time monitoring. Phase3D's involvement in ASTRO America’s Challenge has influenced the development of this kit. The company's focus on deep-tech R&D and commercial scalability is evident in its efforts to standardize material qualification processes. The tool's release aligns with the industry's need for scalable solutions in metal additive manufacturing.

3DPrint.com
Over-the-Air Lasers Aim to Solve the Internet’s “Middle Mile”

Over-the-Air Lasers Aim to Solve the Internet’s “Middle Mile”

IEEE Spectrum
Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.

SemiWiki
MindsEye's sabotage mission is being slammed as dull and pointless

MindsEye's sabotage mission is being slammed as dull and pointless

Build A Rocket Boy accuses individuals of sabotaging MindsEye's launch, spending over €1 million on damaging efforts. The studio integrates the controversy into a new in-game mission, Blacklist, to showcase evidence of sabotage to players. However, reports describe the mission as lackluster and failing to deliver a compelling narrative. Critics attribute the launch issues to internal problems, such as management and design decisions, casting doubt on the sabotage claims. The saga continues as MindsEye's post-launch turmoil unfolds.

TweakTown

We use cookies

We use cookies to ensure you get the best experience on our website. For more information on how we use cookies, please see our cookie policy.