Technology

Upgraded Nvidia RTX 5090 gets 128GB VRAM and $13,000 price tag — 'super limited' GPU is described as a 'prototype'

Source

Tom's Hardware

Published

Sep 8, 2025

TL;DR

AI Generated

A modified Nvidia RTX 5090 GPU with an impressive 128GB of VRAM has surfaced, priced at around $13,200, significantly higher than the standard model. This custom GPU is considered a prototype due to its use of GDDR7X memory, not widely available yet. The mod involves intricate custom PCB designs to accommodate the increased memory capacity. Despite the high price tag, the modded GPU demonstrates the potential for enhanced memory configurations beyond what is currently offered by manufacturers. Buyers should be cautious of fraudulent sales of modified GPUs on secondhand markets.

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Nvidia RTX 5090 reset bug prompts $1,000 reward for a fix — cards become completely unresponsive and require a reboot after virtualization reset bug, also impacts RTX PRO 6000

Nvidia's RTX 5090 and RTX PRO 6000 GPUs are affected by a virtualization reset bug that renders the cards unresponsive until the host system is rebooted. CloudRift has offered a $1,000 reward for a fix to this issue, which impacts Blackwell-equipped systems. Users have reported similar failures, with the bug potentially limited to Nvidia's Blackwell family of GPUs. The bug poses risks for multi-tenant AI workloads and virtualization setups. Nvidia has not yet addressed the problem, and there are no known workarounds.

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Noctua wants to create a custom GeForce RTX 5090, but there aren't enough chips

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Amazon Prime members can grab this RTX 5090 for its lowest-ever price

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Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.

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