Ultralow-Loss PIC Platform From Violet to Near-Infrared, CMOS-Foundry Compatible (Caltech, UCSB et al.)

Researchers from Caltech, UCSB, Leiden University, and University of Southampton published a technical paper introducing an ultralow-loss photonic integrated circuit (PIC) platform based on germano-silicate material, compatible with CMOS foundry processes. The platform aims to achieve fiber-like loss for photonic integration from violet to near-infrared wavelengths. The paper discusses the potential of this platform in advancing optical communication technologies. The research findings were published in Nature and provide insights into the development of high-performance optical components for various applications.