TSMC says advanced‑node capacity falls ‘about three times short’ of AI demand — company's wafer capacity is 'still not enough' as demand continues to rise

TSMC's Chairman and CEO, C. C. Wei, expressed at the SIA Awards that the company's advanced-node capacity falls significantly short of the rising demand, estimating it to be about three times less than what major customers plan to consume. Despite expansions in various regions, including Japan, the U.S., and Europe, the demand for AI-driven technologies surpasses expectations. Challenges such as EUV tool availability and workforce access further complicate the situation. The shortage of leading-edge silicon may continue to impact product releases and roadmap execution for the foreseeable future, as highlighted by Wei's remarks.