TSMC’s CoWoS® Sustainability Drive: Turning Waste into Wealth

TSMC has launched a sustainability initiative within its advanced packaging operations, focusing on its CoWoS® technology, to reduce waste and generate economic value. By repurposing scrap wafers into dummy dies for the CoWoS® packaging process, TSMC has achieved significant annual green benefits and carbon reduction. This initiative aligns with TSMC's broader ESG strategy and exemplifies a circular economy model in semiconductor manufacturing. TSMC plans to expand the use of recycled wafers across different packaging technologies, aiming to maximize resource efficiency while upholding product quality standards.