TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona

TSMC is reportedly accelerating the construction of an advanced packaging facility in Arizona, potentially paving the way for 'all American' chips before 2030. The company's expansion plans in Arizona include building six Fab 21 modules, two advanced packaging facilities, and an R&D center. The decision to prioritize the advanced packaging facility could be driven by factors like customer demands and reducing risks related to chip tariffs. TSMC's partnership with Amkor, set to become a major OSAT provider in the U.S., is also part of its long-term strategy. The company's detailed plans for the advanced packaging facility may be revealed during an upcoming earnings call in January.