Technology

TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona

Source

Tom's Hardware

Published

Dec 6, 2025

TL;DR

AI Generated

TSMC is reportedly accelerating the construction of an advanced packaging facility in Arizona, potentially paving the way for 'all American' chips before 2030. The company's expansion plans in Arizona include building six Fab 21 modules, two advanced packaging facilities, and an R&D center. The decision to prioritize the advanced packaging facility could be driven by factors like customer demands and reducing risks related to chip tariffs. TSMC's partnership with Amkor, set to become a major OSAT provider in the U.S., is also part of its long-term strategy. The company's detailed plans for the advanced packaging facility may be revealed during an upcoming earnings call in January.

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TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona

TL;DR

Similar Articles

Lexar regional manager says that RAM prices are expected to double by the end of the year — 'discounts' and stabilized prices result from distributors getting rid of old stock or sourcing products from other regions

Taiwanese startup FormulaV Line wants to break into US market with two new unique cases — company expects products to become available on Newegg later this year

G.Skill explains how AMD EXPO ULL unlocks additional performance — expanded profiles allow memory makers to include subtiming tweaks for the first time

Huawei-led team claims it post-trained DeepSeek's 1.6-trillion-parameter model — 1,000 Ascend 910C chips used in training