TSMC and Cadence Strengthen Partnership to Enable Next-Generation AI and HPC Silicon

TSMC and Cadence are deepening their partnership to drive advancements in AI and HPC technologies by aligning design automation, 3D-IC technologies, and IP with TSMC's advanced process nodes. The collaboration focuses on supporting TSMC's cutting-edge process technologies like N3, N2, and A16™ to meet the demands of AI workloads. Joint efforts on future nodes, including the A14 process, aim to accelerate design work and adoption of next-gen silicon technologies. The partnership also enhances TSMC's 3DFabric® platform for heterogeneous integration and supports photonics integration for AI and data center applications. Together, TSMC and Cadence aim to streamline the design-to-silicon process, empowering customers to deliver faster, more energy-efficient AI and HPC solutions.