Thermal Characterization For Power Semiconductor Packages (KATECH)

Researchers from the Korea Automotive Technology Institute published a paper on thermal resistance in power semiconductor devices, introducing a new analytical extraction method that improves accuracy and consistency in measuring thermal performance. The method utilizes derivative and curvature analyses to identify thermal boundaries and separate thermal resistances at different levels within the package. Experiments on silicon and silicon carbide devices confirmed the method's reproducibility and revealed material-dependent thermal behavior. The study suggests that optimizing package design, rather than chip modification, is key to reducing overall thermal resistance in power semiconductors.