Technology
‘Still, you’re paying for dinner,’ Nvidia CEO shoots back after TSMC CEO jokes about his $4 trillion NT net worth
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Tom's Hardware
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Dr. L.C. Lu on TSMC Advanced Technology Design Solutions
Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.
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Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more performance, thermal conductivity improved by 50%
Intel is progressing with its 18A-P process node technology, boasting higher performance, lower power consumption, and improved thermals compared to its baseline 18A technology. The 18A-P process introduces new transistors, tighter process variability control, and enhanced thermals, potentially attracting interest from companies like Apple. This enhanced technology offers a 9% performance boost or an 18% power reduction compared to the base 18A process. Additionally, improvements in skew corner tightening, threshold voltage options, and metal stack resistance and capacitance contribute to better performance efficiency and yield. The 18A-P process also focuses on enhancing thermals, reliability, and voltage behavior critical for both client and data center applications.
Tom's Hardware•
Chinese GPU maker Cambricon's Q1 revenue hits $423 million as country's homegrown AI chip market accelerates — Chinese chipmakers continue to leech market share from Nvidia
Chinese GPU maker Cambricon Technologies reported a Q1 revenue of $423 million, marking a significant increase over the previous year. The company's net profit also rose by 185%, reflecting its growth in the AI chip market. Cambricon's success comes as Chinese chipmakers, including MetaX Integrated Circuits, are gaining market share from Nvidia in China. Despite facing challenges, such as losing Huawei as a major customer, Cambricon has shown substantial growth and profitability. The company aims to increase its AI accelerator shipments in 2026 and is positioned as a key player in China's AI hardware supply chain.
Tom's Hardware•
Framework's new RTX 5070 12GB graphics module costs a whopping $1,199 — 72% more expensive than $699 8GB version, says pricing is beyond its control
Nvidia released a new 12GB version of the RTX 5070 mobile GPU with upgraded memory chips, increasing memory throughput. Framework introduced a new graphics module for its Framework Laptop 16 featuring this GPU, priced at $1,199, a significant increase from the $699 8GB version. The high cost is attributed to the expensive GDDR7 memory and the ongoing global memory shortage. Framework clarified that the pricing is influenced by external factors and not within its control, highlighting the challenges faced by consumers due to the current market conditions.
Tom's Hardware•