SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains

SK hynix is investing $3.9 billion in building its first U.S. packaging plant for HBM in Indiana, aiming to address the bottleneck in high-end GPU production and meet the increasing demand for AI silicon. The facility, partially funded by CHIPS Act grants, will produce turnkey HBM modules for AI accelerators by 2028, challenging TSMC's dominance in HBM packaging. By vertically integrating its supply chain, SK hynix aims to offer a complete solution to customers, potentially reshaping the AI supply chain landscape. The move aligns with the U.S. government's focus on advanced packaging as a national security priority, with SK hynix poised to become a key player in the evolving AI supply chain.