SK hynix shows 16-Hi HBM4 memory for AI accelerators — 48 GB at 10 GT/s over a 2,048 interface

SK Hynix showcased its 16-Hi HBM4 memory at CES, featuring a 48 GB capacity with a 2,048-bit interface and operating at 10 GT/s, surpassing JEDEC specifications. The HBM4 technology allows for taller stacks and denser I/O and power bumps compared to HBM3. The backside of HBM4 exhibits a more densely packed BGA pin field, indicating higher bandwidth and power delivery capabilities. These advancements are achieved through custom DRAM dies on a 1b-nm process, promising improved performance and potentially lower costs for end users.