SK hynix reveals DRAM development roadmap through 2031 — DDR6, GDDR8, LPDDR6, and 3D DRAM incoming

SK hynix has unveiled its DRAM development roadmap at the SK AI Summit 2025, showcasing plans for DDR6, GDDR8, LPDDR6, and 3D DRAM up to 2031. The roadmap, while lacking specific details, highlights the evolution of DRAM technology and the expected timelines for new technologies. DDR, GDDR, and LPDDR will continue to cater to AI server memory needs, with DDR5 evolving into MRDIMM Gen2 by 2026-2027. LPDDR6 is projected to offer high-capacity, high-performance, and low power consumption by the end of the decade, with specialized LPDDR6-PIM solutions anticipated in 2028. High-bandwidth flash products comparable to HBM are not expected until 2030.