Technology

SK hynix reveals DRAM development roadmap through 2031 — DDR6, GDDR8, LPDDR6, and 3D DRAM incoming

Source

Tom's Hardware

Published

Nov 5, 2025

TL;DR

AI Generated

SK hynix has unveiled its DRAM development roadmap at the SK AI Summit 2025, showcasing plans for DDR6, GDDR8, LPDDR6, and 3D DRAM up to 2031. The roadmap, while lacking specific details, highlights the evolution of DRAM technology and the expected timelines for new technologies. DDR, GDDR, and LPDDR will continue to cater to AI server memory needs, with DDR5 evolving into MRDIMM Gen2 by 2026-2027. LPDDR6 is projected to offer high-capacity, high-performance, and low power consumption by the end of the decade, with specialized LPDDR6-PIM solutions anticipated in 2028. High-bandwidth flash products comparable to HBM are not expected until 2030.

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SK hynix reveals DRAM development roadmap through 2031 — DDR6, GDDR8, LPDDR6, and 3D DRAM incoming

TL;DR

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Lexar regional manager says that RAM prices are expected to double by the end of the year — 'discounts' and stabilized prices result from distributors getting rid of old stock or sourcing products from other regions

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SK hynix reveals DRAM development roadmap through 2031 — DDR6, GDDR8, LPDDR6, and 3D DRAM incoming

TL;DR

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Huawei-led team claims it post-trained DeepSeek's 1.6-trillion-parameter model — 1,000 Ascend 910C chips used in training