Signal Integrity Verification Using SPICE and IBIS-AMI

Signal integrity verification for high-speed signals like those in memory interfaces and data center backplanes requires addressing signal distortions. Siemens has developed a tool that integrates IBIS, IBIS-AMI, S-parameter interconnect, and SPICE for accurate high-speed link verification. The Solido Simulation Suite supports IBIS-AMI models and enables verification of complex systems like DDR5 and SerDes designs. By combining SPICE with IBIS-AMI, non-linear effects in high-speed applications can be accurately captured, ensuring efficient verification of circuits.