Semiconductor Metrology: IMMSE For The Rapid ID of Defective Chips (Samsung)

Researchers at Samsung have developed a new semiconductor metrology system called Ultra-wide-field imaging Mueller matrix spectroscopic ellipsometry (IMMSE) that enables large-area measurements with a 20mm x 20mm field of view and a spatial resolution of 6.5µm. This system can acquire over 10 million Mueller matrix spectra within the field of view, allowing for spatially dense metrology across the entire wafer area. By leveraging machine learning and numerous MM spectra, the IMMSE system can identify spatial variations of dynamic random access memory (DRAM) structures within individual chips and across the wafer, potentially enhancing yield in semiconductor manufacturing.