Scaling Multi-Die Connectivity: Automated Routing for High-Speed Interfaces

The article discusses the importance of automated routing for high-speed interfaces in multi-die systems adopting advanced interconnect standards like High-Bandwidth Memory (HBM) and Universal Chiplet Interconnect Express (UCIe). These standards require dense interconnect fabrics while maintaining signal integrity and performance, making automated routing methodologies essential. Challenges in multi-die interfaces include routing congestion, signal integrity concerns, and complex routing paths due to die placement and alignment. Early feasibility analysis and automated routing solutions are crucial for efficient implementation and optimizing electrical performance. The Synopsys 3DIC Compiler platform offers automated routing solutions for high-bandwidth die-to-die interconnects, supporting specialized capabilities for HBM and UCIe to accelerate implementation timelines and reduce design risk.