Russia outlines EUV litho chipmaking tool roadmap through 2037 — country eyes replacing DUV with EUV

The Institute of Microstructure Physics of the Russian Academy of Sciences has revealed a roadmap for developing domestic extreme ultraviolet (EUV) lithography tools from 2026 to 2037, aiming to replace deep ultraviolet (DUV) with EUV technology. The plan involves using hybrid solid-state lasers, xenon plasma-based light sources, and Ru/Be mirrors to operate at an 11.2nm wavelength, avoiding ASML's tool architecture. The roadmap includes three stages with increasing capabilities, targeting sub-10nm production by 2037. Russia's goal is to offer a cost-effective lithography system without immersion or tin-based plasma, potentially appealing to smaller foundries and international customers. The project could revolutionize chip manufacturing with lower costs if successfully executed.