Research Bits: Jan. 20

Researchers have developed an atomic layer deposition (ALD) process for chip interconnects using a ruthenium (Ru) precursor with high thermal stability, producing dense, high-quality Ru films with low resistivity. Another study introduced a 3D printing method to create vertical nanolasers for optical integrated circuits, allowing for precise control of ink droplets at the attoliter scale. Additionally, hydrogel-based 3D transistors were designed to mimic human brain neurons, offering potential applications in bioelectronics for healthcare and education. These advancements mark significant progress in chip manufacturing, optical computing, and bioelectronics technologies.