Redefining Backside Metallization: Low‑Temperature Solutions For HDFO And S‑SWIFT Designs

The article discusses the importance of efficient heat dissipation in fan-out packages, particularly in High-Density Fan-Out (HDFO) packaging for AI and high-performance computing applications. The focus is on the S-SWIFT package design, which accommodates high-performance chips with increased integration density. The article explores low-temperature backside metallization (BSM) solutions for these packages, highlighting the need for thermal dissipation performance enhancements. Various BSM process flows and stack-up configurations are evaluated, emphasizing the use of low-temperature processes for fan-out packages. The study concludes that low-temperature BSM processes are viable for fan-out package applications, showcasing the benefits of alternative adhesion materials and process optimizations for improved reliability.